Koocu 2602 138°C 2-in-1 BGA & IC Solder Kit - Albarak

Koocu 2602 138°C 2-in-1 BGA & IC Solder Kit - Albarak

Lower Heating Threshold and Maximum Safety for Delicate IC Reballing

Are you looking for a low-temperature solder paste syringe kit that protects sensitive multi-layer smartphone motherboards and stacked IC chips from high-heat damage? Designed for professional technicians, the Koocu 2602 138°C 2-in-1 BGA & IC Solder Kit provides a precise low-melting compound paired with dispensing needles and a booster bar for seamless motherboard repairs.

⚡ Quick Specifications

Product Type: Low-Temperature BGA & IC Solder Paste Syringe Kit

Brand / Model: Koocu 2602 (2-in-1 Variant)

Melting Point: 138°C Low-Temperature Alloy Formulation

Kit Contents: Solder paste syringe, precision dispensing needles, and a smooth booster bar

Application: Layered smartphone motherboard repairs, IC chip reballing, CPU soldering, and heat-sensitive component rework

💎 Why Buy From Albarak Mobile?

Whether you are a professional mobile technician, a repair shop owner, or an electronics enthusiast, Albarak Mobile provides workshop-grade essentials with trusted nationwide service:

Low-Temperature Protection: Formulated with a 138°C melting point that safeguards delicate, heat-sensitive components and layered sandwich motherboards from warping or thermal destruction during reflow.

Complete All-In-One Kit: Comes fully equipped with a convenient syringe applicator, specialized dispensing needles, and a booster rod to give you absolute control over paste volume and placement.

Smooth Wettability and Flow: Features an active flux compound mixed with fine solder particles, ensuring clean wetting, minimal residue, and strong, reliable structural bonds on tiny BGA pads.

Nationwide Delivery: Fast, secure, and reliable shipping straight to your doorstep or retail shop anywhere in Pakistan.